Notice

A paper from BIAS lab (Prof. Seong-Jin Kim) has been accepted for presentation at IEEE International Solid-State Circuits Conference (ISSCC) held in a virtual platform in Feb. 2021.

The ISSCC is the most prestigious conference in semiconductor integrated circuits and systems and is also called “Semiconductor Olympic.” Since the first event in 1954, every year, more than 3,000 researchers from industry and academia over the world participate in presenting and exchanging state-of-the-art technologies and research outcomes. The next year’s ISSCC is the 68th and has the theme, “Integrated Intelligence is the Future of Systems.”

The first author is Bumjun Kim who is currently pursuing a Ph.D. degree. In this research, he presents a zoom histogramming time-to-digital converter (TDC) for LiDAR sensors that can provide 3-D imaging. The proposed TDC integrated into each pixel generates depth information without any complicated post-processing, realizing a flash LiDAR module. In addition, a two-step TDC architecture zooms in the depth values, offering accurate 3-D images in detail.

Related news: https://news.naver.com/main/read.nhn?mode=LSD&mid=sec&sid1=101&oid=008&aid=0004504269

L1 conference: 2021 IEEE ISSCC, Feb. 2021

Authors: Bumjun Kim, Seonghyeok Park, Jung-Hoon Chun, Jaehyuk Choi, and Seong-Jin Kim

Title: A 48×40 13.5-mm Depth Resolution Flash LiDAR Sensor with In-pixel Zoom Histogramming Time-to-Digital Converter